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- Suited for IR and vapor reflow solder processes
- Rated up to 130°C operating temperature (ambient plus temperature rise)
- Standard packaging in tubes, optional packaging in plastic trays or tape-and-reel
- Custom des
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- Designed for Telecom Power Systems
- Low Profile, High Current Capability
- Self-Leaded design minimizes PCB space
- Wide Inductance Range
- Suited for IR reflow and wave solder processes
- Compatible with
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- Based on EFD core style with thru-hole or surface mount options.
- Extremely low profile package.
- Extremely low DCR coil design used for gapped and ungapped versions.
- 130°C temperature rating (UL class B).
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- Up to 60% more energy space
- Patented Technology
- 15 to 260 amps
- Over 850 standard designs
- ISO 9001 certified manufacturer
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- Ideal for robust applications.
- Low EMI/Self shielded design.
- Wide operating temperature range.
- Low DCR for cool operation.
- Designed for low ripple.
- Stable inductance over varying loads.
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